509.604 PEOPLE
| People | Locations | Statistics |
|---|---|---|
| Mouftah, Hussein T. |
| |
| Dugay, Fabrice |
| |
| Rettenmeier, Max |
| |
| Tomasch, Ernst | Graz |
|
| Cornaggia, Greta |
| |
| Palacios-Navarro, Guillermo |
| |
| Uspenskyi, Borys V. |
| |
| Khan, Baseem |
| |
| Fediai, Natalia |
| |
| Derakhshan, Shadi |
| |
| Somers, Bart | Eindhoven |
|
| Anvari, B. |
| |
| Kraushaar, Sabine | Vienna |
|
| Kehlbacher, Ariane |
| |
| Das, Raj |
| |
| Werbińska-Wojciechowska, Sylwia |
| |
| Brillinger, Markus |
| |
| Eskandari, Aref |
| |
| Gulliver, J. |
| |
| Loft, Shayne |
| |
| Kud, Bartosz |
| |
| Matijošius, Jonas | Vilnius |
|
| Piontek, Dennis |
| |
| Kene, Raymond O. |
| |
| Barbosa, Juliana |
|
Schneider-Ramelow, M.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2021Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approachcitations
- 2019Numerical estimation of local load during manufacturing process in high temperature PCB resin based on viscoelastic material modelingcitations
- 2018High temperature encapsulation for smart power devices
- 2018Frequency-modulated laser ranging sensor with closed-loop controlcitations
- 2015Advanced approach of calculating wire bond pull test correction factors
- 2014Investigating wire bonding pull testing and its calculation basicscitations
- 2013Smart power module molding advances: Evaluating high temperature suitability of molding compounds
- 2012Transfer molding technology for smart power electronics modules: Materials and processescitations
Places of action
| Organizations | Location | People |
|---|