380.256 PEOPLE
| People | Locations | Statistics |
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| Seuring, Stefan |
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| Nor Azizi, S. |
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| Pato, Margarida Vaz |
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| Kölker, Katrin |
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| Huber, Oliver |
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| Király, Tamás |
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| Spengler, Thomas Stefan |
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| Al-Ammar, Essam A. |
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| Dargahi, Fatemeh |
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| Mota, Rui |
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| Mazalan, Nurul Aliah Amirah |
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| Macharis, Cathy | Brussels |
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| Arunasari, Yova Tri |
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| Nunez, Alfredo | Delft |
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| Bouhorma, Mohammed |
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| Bonato, Matteo |
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| Fitriani, Ira |
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| Autor Correspondente Coelho, Sílvia. |
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| Pond, Stephen |
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| Okwara, Ukoha Kalu |
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| Toufigh, Vahid |
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| Campisi, Tiziana | Enna |
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| Ermolieva, Tatiana |
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| Sánchez-Cambronero, Santos |
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| Agzamov, Akhror |
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Reichl, H.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2009Embedding technology development for a 77 GHz automotive radar system
- 2009Non-destructive electrical measurement of interconnect degradation in early states by the use of RF signalscitations
- 2009Realisation of embedded-chip QFN packages - technological challenges and achievements
- 2009Embedding technologies for an automotive radar systemcitations
- 2009Stretchable circuit board technology in textile applicationscitations
- 2009Modeling and comparison of patch antenna configurations for 77 GHz radar applications
- 2009Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnectionscitations
- 2008Highly integrated flexible electronic circuits and modulescitations
- 2008Lead free solder joints: reliability and metallurgical reactions
- 20083D packaging for image sensor application
- 2006Reliable miniaturized wireless sensors for automotive applicationscitations
- 2006Improved reliability of leadfree flip chip assemblies using direct underfilling by transfer moldingcitations
- 2006Identifying the reliability affecting parameters of SBB flip chip interconnections for automotive applicationscitations
- 2005Reliability potential of epoxy based encapsulants for automotive applicationscitations
- 2005High temperature potential of flip chip assemblies for automotive applicationscitations
- 2002Flip chip molding - highly reliable flip chip encapsulationcitations
- 2002Flip chip molding - Recent progress in flip chip encapsulationcitations
- 2000Integration of micro-mechatronics in automotive applications
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