469.901 PEOPLE
| People | Locations | Statistics |
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| Sourd, Romain Crastes Dit |
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| Marton, Peter |
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| Toaza, Bladimir |
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| Lubashevsky, Katrin |
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| Ambros, Jiří |
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| Niederdränk, Simon |
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| Khoshkha, Kaveh |
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| Brenner, Thomas |
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| Badea, Andrei | Delft |
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| Michálek, Tomáš | Pardubice |
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| Jensen, Anders Fjendbo | Kongens Lyngby |
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| Le Goff, A. |
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| Greer, Ross |
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| Gutiérrez, Javier | Madrid |
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| Sagues, Mikel |
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| Eggermond, Michael Van |
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| Milica Milovanović, M. |
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| Carrasco, Juan-Antonio |
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| Groen, Eric L. |
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| Tzenos, Panagiotis |
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| Mesas, Juan-José |
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| Oikonomou, Maria G. |
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| Messiou, Chrysovalanto |
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| Giuliani, Felice |
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| Roussou, Julia |
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Reichl, H.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (21/21 displayed)
- 2009Modeling and comparison of patch antenna configurations for 77 GHz radar applications
- 2009Realisation of embedded-chip QFN packages - technological challenges and achievements
- 2009Embedding technologies for an automotive radar systemcitations
- 2009Effects of additional elements (Fe, Co, Al) on SnAgCu solder jointscitations
- 2009Stretchable circuit board technology in textile applicationscitations
- 2009Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnectionscitations
- 2009Embedding technology development for a 77 GHz automotive radar system
- 2009Non-destructive electrical measurement of interconnect degradation in early states by the use of RF signalscitations
- 20093D image sensor SiP with TSV silicon interposercitations
- 2008Highly integrated flexible electronic circuits and modulescitations
- 20083D packaging for image sensor application
- 2008Lead free solder joints: reliability and metallurgical reactions
- 2006Embedding of active and passive components into printed wiring boards
- 2006Identifying the reliability affecting parameters of SBB flip chip interconnections for automotive applicationscitations
- 2006Reliable miniaturized wireless sensors for automotive applicationscitations
- 2006Improved reliability of leadfree flip chip assemblies using direct underfilling by transfer moldingcitations
- 2005High temperature potential of flip chip assemblies for automotive applicationscitations
- 2005Reliability potential of epoxy based encapsulants for automotive applicationscitations
- 2002Flip chip molding - highly reliable flip chip encapsulationcitations
- 2002Flip chip molding - Recent progress in flip chip encapsulationcitations
- 2000Integration of micro-mechatronics in automotive applications
Places of action
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