467.600 PEOPLE
| People | Locations | Statistics |
|---|---|---|
| Serhiienko, Serhii |
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| Schmalz, Ulrike |
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| Oliveira, Marisa |
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| Ribeiro Pereira, Maria Teresa |
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| Bellér, Gábor |
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| Araujo, M. |
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| Frey, Michael | Karlsruhe |
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| Coutinho-Rodrigues, João | Coimbra |
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| Wouters, Christian Guillaume Louise | Aachen |
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| Kessel, Paul J. Van Van |
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| Árpád, István |
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| Fontul, Simona |
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| Kocsis, Dénes |
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| Cigada, Alfredo | Milan |
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| Oort, Neils Van | Delft |
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| Agárdi, Anita | Miskolc |
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| Andrews, Gordon E. |
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| Sousa, Nuno |
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| Witlox, Frank Jacomina Albert | Ghent |
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| Dobruszkes, Frederic |
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| Kiss, Judit T. |
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| Hadachi, Amnir | Saint-Étienne-du-Rouvray |
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| Hamilton, Carl J. | Kunovice |
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| Misiura, Serhii |
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| Schimpf, Marina |
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Khatir, Zoubir
in Cooperation with on an Cooperation-Score of 37%
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- show 189 more
Publications
- 2021Effect of load sequence interaction on bond-wire lifetime due to power cycling
- 2020Thermal behaviour evolution of an IGBT module after aging measured by thermoreflectance
- 2020Thermal mapping at the cell level of chips in power modules through the silicone gel using thermoreflectance
- 2020Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation model
- 2020Wire-bond contact degradation modeling for remaining useful lifetime prognosis of IGBT power modules
- 2020Using of Bond-Wire Resistance as Ageing Indicator of Semiconductor Power Modules
- 2020Using of bond-wire resistance as aging indicator of semiconductor power modules
- 2020Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling
- 2019New solution of the partial differential equation of the grain groove profile problem in the case of evaporation/condensation
- 2019Stress-based Model for Lifetime Estimation of Bond-Wire Contacts using Power Cycling Tests and Finite Element Modelling
- 2019Constant "Tj Power Cycling Strategy in DC Mode for Top-Metal and Bond-Wire Contacts Degradation Investigations
- 2018Analytical Solutions to the Problem of the Grain Groove Profile
- 2018Theoretical investigation of the charges weight between interface and oxygen traps in barrier layer on the 2DEG density of Al2O3/AlGaN/GaN HEMTs
- 2018Effect of power cycling tests on traps under the gate of Al2O3/AlGaN/GaN normally-ON devices
- 2018New Analytical Model for Real-Time Junction Temperature Estimation of Multichip Power Module Used in a Motor Drive
- 2018Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cycling
- 2017Electrothermal evaluation of single and multiple solder void effects on low-voltage Si MOSFET behavior in forward bias conditions
- 2017Dispersion of electrical characteristics and short-circuit robustness of 600V E-mode GaN transistors
- 2017New Electro-Thermal Model for a Multichip Power Module Used in a Motor Drive
- 2017Comparative analysis of two hybrid energy storage systems used in a two front wheel driven electric vehicle during extreme start-up and regenerative braking operations
- 2017Evaluation of multi-void and drain metallization thickness effects on the electro thermal behavior of Si MOSFET under forward bias conditions
- 2017Regenerative braking modeling, control and simulation of a hybrid energy storage system for an electric vehicle in extreme conditionscitations
- 2016Comparison between two braking control methods integrating energy recovery for a two-wheel front driven electric vehiclecitations
- 2016Optimal Traction and Regenerative Braking Reference Current Synthesis for an IPMSM Motor using Three Combined Torque Control Methods for an Electric Vehiclecitations
- 2016Integration of different modules of an electric vehicle powered by a battery-flywheel storage system during traction operationcitations
- 2016Energy management of a battery-flywheel storage system used for regenerative braking recuperation of an Electric Vehiclecitations
- 2016Control strategy for extreme conditions regenerative braking of a hybrid energy storage system for an electric vehiclecitations
- 2016Regenerative Braking Modeling, Control, and Simulation of a Hybrid Energy Storage System for an Electric Vehicle in Extreme Conditionscitations
- 2016Integration of different modules for regenerative braking control of a two front wheel-driven EV
- 2016Power Cycling Issues and Challenges of SiC-MOSFET Power Modules in High Temperature Conditions
- 2016Power Cycling Tests in High Temperature Conditions of SiC-MOSFET Power Modules and Ageing Assessment
- 2016Numerical and Experimental Evaluation of the Microsecond Pulsed Heating Curve Technique Dedicated to Die Interconnection Characterization
- 2015A review on DC/DC converter architectures for power fuel cell applications
- 2015Part-load control stategy of a 20kW SiC power converter for embedded PEMFC multi-stack architectures
- 2015Design and control of a high frequency six-phase interleaved DC/DC converter based on SiC power MOSFETs for a PEMFC
- 2015Temperature and strain mappings over forward biased power IGBT cross-section area by ¼-Raman spectroscopy
- 2015Mechanical and Thermal Stresses Characterization Maps on Cross-sections of Forward Biased Electronic Power Devices
- 2014Micro-Raman spectroscopy for stress analysis in high power silicon devices
- 2014Evaluation du comportement électrothermique de transistors MOSFET en conduction en présence de défaut dans la brasure
- 2014Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditions
- 2014Temperature mapping by µ-Raman spectroscopy over cross-section area of power diode in forward biased conditions
- 2013Power cycling ageing tests at 200°C of SiC assemblies for high temperature electronics
- 2013Top-metal ageing effects on electro-thermal distributions in an IGBT chip under short circuit conditions
- 2013Partial Thermal Impedance Measurement for Die Interconnection Characterization by a Microsecond 'Pulsed Heating Curve Technique'
- 2013Robustness of 1.2 kV SiC MOSFET devices
- 2013Reliability of power MOSFET-based smart switches under normal and extreme conditions for 24 V battery system applications
- 2013Distributed electro-thermal model of IGBT chip – application to top-metal ageing effects in short circuit conditions
- 2013Investigation of 1.2 kV Investigation of SiC MOSFETs for Aeronautics Applications
- 2013Main issues and limitations in Power cycling tests for future integrated power converters
- 2013Saturation Current and On-Resistance Correlation during During Repetitive Short-Circuit Conditions on SiC JFET Transistors
- 2013Power cycling aging tests at 200°C of SiC assemblies for high temperature electronics
- 2012New Investigation Possibilities on Forward Biased Power Devices using Cross-Sections
- 2012Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters – A Review
- 2012Junction Temperature Investigations Based on a General Semi-Analytical Formulation of Forward Voltage of Power Diodes
- 2012Comparison Study on Performances and Reliability between MOSFET & JFET Silicon carbide technologies - Abilities for Aeronautics Application
- 2012Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters - A Review
- 2011Characterization and aging test methodology for power electronic devices at high temperaturecitations
- 2011Effect of die metallization layer ageing in the case of power semiconductor devices
- 2011Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications
- 2011Development and electrical characterization of a vertical electrical and thermal test chip (VTTC)
- 2010Investigations on junction temperature estimation based on junction voltage measurements
- 2010Etude d'interfaces thermiques pour le management thermique des modules de puissance
- 2009Rupture fragile et fatigue des substrats DBC. Applications haute température
- 2007Degradation behavior of 600V-200A IGBT modules under Power cycling and high temperature environment conditions
- 2007Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules
- 2007Evaluation de technologies de substrats céramiques sous des cyclages en température de forte amplitude
- 2007Ageing Test Results of low voltage MOSFET Modules for Electrical Vehicles
- 2007Failure modes on low voltage power MOSFETs under high temperature application
- 2006Fiabilité des composants de puissance dans des environnements hautes températures
- 2006Study of Different Ceramic Substrates Technologies under High Temperature Cycles
- 2006Evaluation of Substrate Technologies under High Temperature Cycling
- 2006Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling
- 2005Composants a semi-conducteur de puissance pour des applications à haute température de fonctionnement
- 2005Electrical Characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications
- 2005Evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications
- 2004Banc de cyclage actif pour l'analyse de la fatigue thermique des brasures de composants IGBTs
- 2004Characterisation of silicon carbide schottky diodes and COOLMOS transistors at high temperature
- 2004Développement d'un module de puissance pour tester la fiabilité d'un convertisseur haute température
- 2004Development of high temperature power module for avionics applications
- 2003Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT
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