479.575 PEOPLE
| People | Locations | Statistics |
|---|---|---|
| Ziakopoulos, Apostolos | Athens |
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| Vigliani, Alessandro | Turin |
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| Catani, Jacopo | Rome |
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| Statheros, Thomas | Stevenage |
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| Utriainen, Roni | Tampere |
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| Guglieri, Giorgio | Turin |
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| Martínez Sánchez, Joaquín |
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| Tobolar, Jakub |
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| Volodarets, M. |
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| Piwowar, Piotr |
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| Tennoy, Aud | Oslo |
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| Matos, Ana Rita |
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| Cicevic, Svetlana |
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| Sommer, Carsten | Kassel |
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| Liu, Meiqi |
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| Pirdavani, Ali | Hasselt |
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| Niklaß, Malte |
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| Lima, Pedro | Braga |
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| Turunen, Anu W. |
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| Antunes, Carlos Henggeler |
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| Krasnov, Oleg A. |
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| Lopes, Joao P. |
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| Turan, Osman |
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| Lučanin, Vojkan | Belgrade |
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| Tanaskovic, Jovan |
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DUPONT, Laurent
Université Gustave Eiffel
in Cooperation with on an Cooperation-Score of 37%
Topics
- behavior
- bicycling
- plant
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- bottleneck
- voltage
- cooling system
- high temperature
- inverter
- atmospheric temperature
- copper
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- semiconductor device
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- silicon
- temperature measurement
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- solder
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- temperature
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- estimate
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- transient
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- parametric analysis
- sensitivity analysis
- sensitivity
- process control
- measuring method
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- chain
- engineering
- electronic equipment
- automation
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- high voltage
- diamond
- petroleum industry
- carbide
- silicon carbide
- cladding
- map
- soldering
- forecasting
- fatality
- cracking
- heeling
- residual stress
- thermal stress
- combustion
- weight
- hybrid vehicle
- designer
- avalanche
- interface
- silver
- sintering
- driver
- automobile
- automobile industry
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- delamination
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- deformation curve
- ceramic material
- test vehicle
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- avionics
- working condition
- thermal fatigue
- show 141 more
Publications (57/57 displayed)
- 2019A Method for Accelerated Aging Tests of Power Modules for Photovoltaic Inverters Considering the Inverter Mission Profiles
- 2018In-situ condition monitoring system to study the ageing of power semi-conductor devices in photovoltaic inverters
- 2017Electrothermal evaluation of single and multiple solder void effects on low-voltage Si MOSFET behavior in forward bias conditions
- 2017Realization and characterization of instrumented power diode with aluminum RTD sensor - application to thermal impedance evaluation
- 2017Evaluation of multi-void and drain metallization thickness effects on the electro thermal behavior of Si MOSFET under forward bias conditions
- 2017A method for accelerated ageing tests of photovoltaic inverters considering the application's mission profiles
- 2017Thermal Characterization of an IGBT Power Module with On-Die Temperature Sensors
- 2016Use as essential factor for Technology Adoption: Case study of electric vehicle’s uses in French regional Ecosystemcitations
- 2016Développement d'une puce instrumentée adaptée à la mesure de température dans les modules de puissance
- 2016Experimental Evaluation of IGBT Junction Temperature Measurement via a Modified-VCE (VCE_VGE) Method with Series Resistance Removal
- 2016Instrumented chip dedicated to semiconductor temperature measurements in power electronic converters
- 2016Numerical and Experimental Evaluation of the Microsecond Pulsed Heating Curve Technique Dedicated to Die Interconnection Characterization
- 2016IR Camera Validation of IGBT Junction Temperature Measurement via Peak Gate Current
- 2015Direct Copper Bonding for Power Interconnects: Design, Manufacturing and Test
- 2015Condition Monitoring: A Decade of Proposed Techniques
- 2015Preliminary Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for Online Chip Temperature Measurements of IGBT Devices
- 2015Experimental evaluation of IGBT junction temperature measurement via peak gate current
- 2014Evaluation de paramètres thermosensibles basés sur la mesure de la tension directe de composants IGBT pour une utilisation dans des conditions d'usage
- 2014Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditions
- 2014Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for On-line Chip Temperature Measurements of IGBT Devices
- 2014Improved reliability of power modules: A review of online junction temperature measurement methods
- 2014Evaluation du comportement électrothermique de transistors MOSFET en conduction en présence de défaut dans la brasure
- 2013Test bench for active ageing of power modules reproducing constraints close to automotive driving conditionscitations
- 2013Partial Thermal Impedance Measurement for Die Interconnection Characterization by a Microsecond 'Pulsed Heating Curve Technique'
- 2013Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters
- 2013Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters
- 2012The combined effect of failure factors in power modules for automotive applications
- 2012Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters – A Review
- 2012Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions - Comparison with infrared measurements
- 2012Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters - A Review
- 2011Characterization and aging test methodology for power electronic devices at high temperaturecitations
- 2011Development and electrical characterization of a vertical electrical and thermal test chip (VTTC)
- 2011Optimization of wire connections design for power electronics
- 2011Investigation of the heel crack mechanism in Al connections for power electronics modules
- 2010Investigations on junction temperature estimation based on junction voltage measurements
- 2010Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode
- 2010Etude d'interfaces thermiques pour le management thermique des modules de puissance
- 2009Accelerated Active Ageing Test on SiC JFETs Power Module with Silver Joining Technology for High Temperature Application
- 2009Innovative connectivity for double side cooling and connection of power dice in the context of automotive power mechatronic packaging for high power inverters
- 2007Evaluation de technologies de substrats céramiques sous des cyclages en température de forte amplitude
- 2007Degradation behavior of 600V-200A IGBT modules under Power cycling and high temperature environment conditions
- 2007Ageing Test Results of low voltage MOSFET Modules for Electrical Vehicles
- 2007Failure modes on low voltage power MOSFETs under high temperature application
- 2007Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules
- 2006Study of Different Ceramic Substrates Technologies under High Temperature Cycles
- 2006Evaluation of Substrate Technologies under High Temperature Cycling
- 2006Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling
- 2006Contribution à l'étude de la durée de vie des assemblages de puissance dans des environnements haute température avec des cycles thermiques de grande amplitude
- 2006Fiabilité des composants de puissance dans des environnements hautes températures
- 2005Electrical Characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications
- 2005Evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications
- 2005Composants a semi-conducteur de puissance pour des applications à haute température de fonctionnement
- 2004Développement d'un module de puissance pour tester la fiabilité d'un convertisseur haute température
- 2004Banc de cyclage actif pour l'analyse de la fatigue thermique des brasures de composants IGBTs
- 2004Characterisation of silicon carbide schottky diodes and COOLMOS transistors at high temperature
- 2004Development of high temperature power module for avionics applications
- 2003Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT
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